Semiconductor lead frame lead stabilization

ABSTRACT

The invention is to an apparatus and method for applying a plastic material to a lead frame for stabilizing the leads and retaining them in a common plane.

FIELD OF THE INVENTION

This invention relates to semiconductor devices, and more particularlyto a lead frame and method for stabilizing lead frame lead spacing andlead tip planarity.

BACKGROUND OF THE INVENTION

In producing delicate, high pin count lead frames with closely spacedinner leads, polyimide or kapton tape is often applied to the leads tomaintain lead-to-lead spacing and to stabilize lead tip planarity. Thisoperation is typically done after stamping or etching the lead frame,and after the lead frame is plated. The process includes indexing andprecisely locating the lead frame unit and applying heat and pressure toa piece or pieces of precisely cut and located polyimide tape to one ormore strips to the lead frame. This procedure is expensive, timeconsuming and subjects the high value added plated lead frame toadditional mechanical handling and heat treatment.

BRIEF DESCRIPTION OF THE INVENTION

The invention is to a process and semiconductor device to which aplastic stabilizer has been applied on and between the inner leadsfingers of a lead frame to stabilize lead frame spacing and planarity.The plastic stabilizer consists of a plastic preform on a support base.The plastic preform and support can be an individual preform, a strip ofpreforms, or a plurality of preforms on a continuous roll.

A heater block is mounted on a piston or press over an anvil typesurface to apply heat and pressure to the non-preform surface of theplastic preform support base. The plastic preform is pressed onto thelead frame leads. The heat causes the plastic preform to melt onto thelead frame and between the lead frame leads, adherent to the lead frame.After the plastic preform has melted onto the lead frame and thencooled, the preform base material is peeled from the molded plastic.

The support base may have index holes, notches, or other indexing meansto accurately locate the preform adjacent the lead frame prior to theapplication of heat and pressure.

The technical advance represented by the invention as well as theobjects thereof will become apparent from the following description of apreferred embodiment of the invention when considered in conjunctionwith the accompanying drawings, and the novel features set forth in theappended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an expanded view of the apparatus of the present invention.

FIG. 2 illustrates the lead frame leads on the preform stabilizer; and

FIG. 3 illustrates the lead frame leads and preform after the preformhas been heated and the lead frame leads pressed into the preform.

DESCRIPTION OF A PREFERRED EMBODIMENT

FIG. 1 is an expanded view of the apparatus of the invention. A leadframe 10 having leads 11 attached to mounting pad 12. Lead frame 10includes side rails 13 having index holes 14. Side rails with indexholes permits indexing a strip or continuous roll of lead framed intoposition for processing.

A carrier or base material 20, having preforms 21 thereon, arepositioned under the lead frames 10. Each preform 21 is shaped, forexample, to under lie the leads 11 in a ring or square perimeter. Theexact shape of preform 21 may vary according to the shape of the leadframe, and the portion of the lead frame to be partially embedded in thepreform material. In FIG. 1, the preform has four sides 22 in a squarepattern such that each side 22 under lies a set of lead frame leads 11.Carrier 20 has index holes 23 along two edges. These index holescorrespond to the index holes 13 in lead frame side rails 13. Thecarrier/preform may be individually pieces, strips or continuous rollsto correspond to the format of the lead frames.

Positioned below the carrier base 20 and preforms 21 is a support base30. Support base 30 has index pins 31 along two sides. These pinscorrespond to the index holes 23 in carrier 20 and holes 14 in leadframe 10.

At the top of FIG. 1, is a heater block 40 mounted on a piston 41.Heater block may be raised and lowered in the process of the invention.A heater block also may be in the support base and the piston used onlyto apply pressure.

The process of the invention is as follows. A individual, strip orcontinuous roll of lead frames 10 are moved adjacent an individual,strip or continuous roll of preforms 20 onto support base 30. The indexholes in lead frame 10 and carrier 20, 14 and 23 respectively, arealigned on index pins 31 on support base 30. Heater block is movedagainst a lead frame, applying heat and pressure. The applied heatcauses the preform material to melt into the lead frame leads. Thepreform material flows between the leads encapsulating three sides ofthe leads, bottom and two sides. When the heater block is removed, thepreform material returns to a solid state, firmly hold the leads is afixed relationship with each other and in a common plane.

Plastic materials such as nylon or polyester may be used. Heat in therange of 150 degree C. to 250 degree C. is applied. The use of plasticmaterials eliminates the use of adhesives, commonly used with polyimidetapes, which may introduce ionic contaminants.

FIG. 2 illustrates the plastic preform 22 adjacent lead fame leads 11prior to the application of heat and pressure. FIG. 3 illustrates theflowed plastic 22a around lead frame leads 11 after the application ofheat and pressure.

In the given example, the preform under lies a segment of the lead fameinternal leads. In practice, the preform could under lie only part ofthe leads and mounting pad or only part of the leads.

What is claimed:
 1. A method for stabilizing multiple leads on a lead frame, including a mounting pad and lead fingers, comprising the steps of:aligning selected portions of the lead fingers, spaced from the mounting pad, with a plastic preform; and applying heat and pressure to the lead frame and plastic preform to melt the plastic causing it to flow around the selected portions of the lead frame leads, securing them in fixed relationship with each other.
 2. The method according to claim 1, wherein the plastic preform is shaped to under lie only the lead frame leads.
 3. The method according to claim 1, wherein said plastic preform is on a carrier base which is peeled away after heat has been applied the plastic has solidified around the leads.
 4. The method according to claim 1, wherein said preform is on a carrier base with index holes for indexing preforms under lead frames, and for aligning the preform with the lead frame.
 5. The method according to claim 4, including the step of aligning the lead frame and preform on a support base utilizing index pins on the support base and index holes in the lead frame and in a preform backing material.
 6. A method for stabilizing multiple leads on a lead frame, including a mounting pad and lead fingers, comprising the steps of:aligning selected intermediate portions of the lead fingers, spaced from the mounting pad, with a plastic preform mounted on a carrier base; applying heat and pressure to the lead frame and plastic preform to melt the plastic causing it to flow around the lead frame leads securing them in fixed relationship with each other; and removing the preform carrier base.
 7. The method according to claim 6, wherein the plastic preform is shaped to under lie only the lead frame leads.
 8. The method according to claim 6, wherein said plastic preform is peeled away after heat has been applied and the plastic has solidified around the leads.
 9. The method according to claim 6, wherein said carrier base has index holes for indexing preforms under lead frames, and for aligning the preform with the lead frame.
 10. The method according to claim 9, including the step of aligning the lead frame and preform on a support base utilizing index pins on the support base and index holes in the lead frame and in a preform backing material. 